Designed to seal small openings in new or existing raised floor cutouts used for communications or power cabling. Based on measurements at multiple data centers, on average 48% of valuable conditioned air is not reaching the air intake of IT equipment due to unsealed floor openings. This lost air, known as bypass airflow, contributes to IT equipment hot spots, cooling unit inefficiencies, and increasing infrastructure costs. KoldLok® products specifically address bypass airflow and its detrimental effects on data center cooling.
Product Number
5050 Raised Floor Grommet, SplitLok™ Square, Black
MSRP: $51.00 (each)
